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I'd recently found very difficuly to remove IC Chip or SMD components from tiny board by using ATTEN AT850 (2 in 1 Hot Air & Soldering rework station), even I switched up to 380 to 450 celcius with airflow in within 3.5 level also yields in nothing.

I did attached those picture for those tools and equipments that I used during my removing jobs. I hope anyone could help me to solve my issues.
 

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You have to heat it for quite a Time , the flux is good and the hot air station should be fine , practise on old boards or buy a cheap smd practice board , several channels i follow on you tube could show you the best techniques, don’t over heat though and try to keep the board temperature fairly even.
 
Sometimes chips have an adhesive/ resin type underfill applied during manufacturing and they can be very difficult to remove. You can usually smell the burning underfill material when you heat it if that's the case.

If it's just a thick multilayered board that's sinking the heat then plenty of flux and flood the component you're trying to remove using a soldering iron and low melting temp solder first. After that the rework heat gun should easily remove it.
 
I'd recently found very difficuly to remove IC Chip or SMD components from tiny board by using ATTEN AT850 (2 in 1 Hot Air & Soldering rework station), even I switched up to 380 to 450 celcius with airflow in within 3.5 level also yields in nothing.

I did attached those picture for those tools and equipments that I used during my removing jobs. I hope anyone could help me to solve my issues.
Smd hotplate, a decent microscope, kapton tape, tools to dig away the under fill, micro soldering iron, hot air gun and lots of practice.
 

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