My take on supplementary bonding:
I don't think it's intended as a backup CPC, although it can achieve that. Its full name "supplementary protective equipotential bonding", and that it includes extraneous parts, leads me to conclude that its main goal is equal potential. The formula we need to meet is:
R <= 50V/Ia (Ia= operating current of protective device)
When a fault to earth occurs, a circuit is completed through which a current flows. As long as this current flows, there will be a voltage drop between the site of the fault and the MET, so there will be a potential difference between the site of the fault, and all metalwork connected to the MET. The aim of supplementary bonding, as I understand it, it to keep that potential difference to no more than 50V.
Example: electric shower without RCD protection, on a B40. Extraneous pipework in touching distance, connected to the MET via main bonding.
Fault of negligible impedance occurs at shower, 200A flows. There is a voltage drop between the shower and the MET, and therefore a potential difference between the shower and the nearby pipework.
50/200 = 0.25ohms
As long as the resistance between the shower and the pipework is 0.25 ohms or less, then the voltage between them will be no more than 50V.
The above example is for a fault that caused instantaneous disconnection. Supposing a tenuous fault occurred that didn't cause instantaneous disconnection. Let's use a fault current of 199 ohms, as this is right on the edge:
50/199 = 0.251 ohms
So as the fault current gets lower, the max resistance between the shower and pipework to keep the potential down to 50V gets higher. If you meet the formula in 415.2.2, then any fault will either instantly disconnect, or will be kept to 50V or lower.